What is the key idea behind wafer level packaging?
Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.
What is wafer scale manufacturing?
Wafer-scale integration (WSI) is a rarely used system of building very-large integrated circuit (commonly called a “chip”) networks from an entire silicon wafer to produce a single “super-chip”.
What is Dsbga?
Die Size Ball Grid Array (DSBGA), also known as Wafer Chip Scale Package (WCSP), refers to packaging an IC in wafer form, in contrast to packaging an IC after it has been singulated from the wafer. It uses a copper redistribution layer to connect the silicon interconnect to an array of solder balls.
What is wafer level testing?
Wafer testing is a step performed during semiconductor device fabrication. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying special test patterns to them.
How many CPUs does a wafer have?
Each CPU has 8 chiplets, so that’s 62 CPUs per wafer.
What is a wafer pack?
The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems.
Is flip chip wafer level packaging?
In recent years, there has been an increased focus on fan-out wafer level packaging. While fan-out wafer level packaging may be the right solution for some designs, it is not always the lowest cost solution. Flip chip packaging, a more mature technology, continues to be an alternative to fan-out wafer level packaging.
What is wire bond and flip chip packaging?
Flip chip is also known as controlled collapse chip connection and the abbreviation for the same is C4. It is a procedure for interconnecting semiconductor devices to external circuitry. On the other hand, wire bonding is the procedure of interconnecting an integrated circuit (IC) or other semiconductor devices.
What is wafer-level packaging?
Furthermore, wafer-level packaging paves the way for true integration of wafer fab, packaging, test, and burn-in at wafer level, for the ultimate streamlining of the manufacturing process undergone by a device from silicon start to customer shipment.
What is the size of the substrate used for wafer-level manufacturing?
Besides technology developments towards heterogeneous integration (including multiple die packaging, passive component integration in package, and redistribution layer or package-on-package approaches), larger substrate formats are targeted. Manufacturing is currently done on wafer level up to 12”/300 mm and 330 mm.
What is wafer level CSP?
They become enablers for new designs, new performances and new applications. Wafer Level CSP was the first generation of wafer level package product to be introduced into the marketplace. Today WLP technology (fan-in WLP) with and without redistribution layers (RDL) is used for a large variety of products.
What is a fan-in wafer level package (WLP)?
The original WLP designs required that all package IO terminals be continuously located within the chip outline (fan-in design) producing a true chip-size package. This structure constituted a fan-in Wafer Level Package with the sequential processing of a complete silicon wafer.